Welcome to the official website of Luoyang Hypersolid Metal Tech Co., Ltd.

sales@hypersolidmetal.com

+86 15836043611

Luoyang Hypersolid Metal Tech Co.,Ltd Luoyang Hypersolid Metal Tech Co.,Ltd

Search

Back to Overview

Choose the Right Tungsten-Copper Material to Solve High-Temperature Electrical and Thermal Conduction Challenges.

Mar 13,2026

Choose the Right Tungsten-Copper Material to Solve High-Temperature Electrical and Thermal Conduction Challenges.

Tungsten-copper (W-Cu) is a classic metal composite material that combines the high-temperature resistance and high hardness of tungsten with the superior electrical and thermal conductivity of copper; it is widely utilized in the electrical, electronics, and aerospace sectors.

I. Composition and Preparation Process
Composition Range: Common grades include WCu10 (10% Cu, 90% W), WCu20, and WCu30, with copper content typically ranging from 6% to 50% (by weight). The composition can be adjusted as needed: higher copper content enhances electrical and thermal conductivity, while higher tungsten content improves high-temperature resistance and mechanical strength.
Core Process: Traditional melt-casting methods are infeasible (as tungsten has a melting point of 3410°C, whereas copper melts at only 1083°C). The mainstream approach is powder metallurgy combined with infiltration: a tungsten skeleton is first pressed and sintered, after which molten copper is infiltrated to fill the pores. Alternatively, mechanical alloying followed by sintering can be employed to ensure structural uniformity and high density.
II. Key Properties
Thermal/Electrical Properties: Thermal conductivity ranges from 140 to 250 W/m·K; the coefficient of thermal expansion is adjustable (6–12 × 10⁻⁶/K); and electrical conductivity is approximately half that of pure copper. At high temperatures, the volatilization of copper generates a "sweating" cooling effect—a critical advantage in extreme thermal environments.
Mechanical and Environmental Resistance: Exhibits high strength and hardness at room temperature; offers excellent resistance to arc erosion and thermal shock; and is readily machinable.
Density: Increases with increasing tungsten content, typically ranging from 14 to 18 g/cm³.

III. Typical Application Fields
Electrical Contacts / Electrodes: Arc contacts for high-voltage circuit breakers and vacuum switches; electrodes for Electrical Discharge Machining (EDM) and resistance welding. Characterized by high ablation resistance and stable current-carrying capacity.
Electronic Packaging & Heat Sinks: Heat dissipation substrates and packaging housings for high-power semiconductors, microwave devices, and laser components. Enables precise thermal management by matching the coefficient of thermal expansion of ceramics and silicon.
Aerospace: Rocket nozzles, thrust vectoring vanes, and nose cones. Utilizes transpiration cooling to withstand the erosive impact of high-temperature gas flows reaching thousands of degrees.
Others: Radiation shielding components, counterweights, and similar parts for medical equipment.

 

 

TAG:

PREVIOUS:

None!

NEXT:

None!

%E7%AC%AC%E4%B8%80%EF%BC%8C%E6%9C%80%EF%BC%8C%E4%BC%98%E7%A7%80%EF%BC%8C%E5%A2%9E%E5%BC%BA%EF%BC%8C%E4%B8%80%E6%B5%81%EF%BC%8C%E5%8D%93%E8%B6%8A%EF%BC%8C%E9%A2%86%E5%85%88%EF%BC%8C%E5%85%88%E8%BF%9B%EF%BC%8C%E5%BC%95%E9%A2%86

Sorry，当前栏目暂无内容!

您可以查看其他栏目或返回 首页

Sorry，The current column has no content!

You can view other columns or return Home