Welcome to the official website of Luoyang Hypersolid Metal Tech Co., Ltd.
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PRODUCTSleading manufacturer of refractory metal products such as tungsten and molybdenum.
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ABOUTThe main products include pure molybdenum, molybdenum alloy such as MoLa, TZM, and MoW; pure tungsten, tungsten alloy such us WCu, WNiFe, WNiCu and so on.
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NEWSHypersolid Metal (our company name) is supplying products to USA, Europe, India and China.
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CONTACTWe also welcome OEM and ODM orders. Whether selecting a current product or seeking engineering assistance for your application, your needs can always be satisfied here.
Applications of Tungsten Frames in Semiconductors
Mar 27,2026
Tungsten frames are extensively utilized within the semiconductor industry, primarily concentrated in critical processes such as high-temperature operations, vacuum environments, thin-film deposition, etching, and diffusion. The core principle behind this application lies in leveraging tungsten's key characteristics: exceptional high-temperature resistance, resistance to deformation, non-contaminating properties, low outgassing, and high purity.
Primary Applications of Tungsten Frames in Semiconductor Manufacturing:
1. Wafer Coating / PVD (Physical Vapor Deposition)
This is one of the most typical applications for tungsten frames.
Used as wafer carriers, fixtures, shadow masks, and shielding rings.
During sputtering processes (e.g., for aluminum, copper, titanium, titanium nitride, etc.), they secure the wafer and prevent non-uniform coating at the edges.
Requirements: High-purity tungsten (W ≥ 99.95%); must not release impurities or contaminate the wafer at high temperatures.
2. CVD / Epitaxy / High-Temperature Diffusion Furnaces
Within high-temperature furnace tubes, tungsten frames serve as boats, supports, and carrier frames:
They carry wafers through processes such as oxidation, annealing, doping, and epitaxial growth.
Operating temperatures typically range from 800°C to 1200°C, or even higher.
Tungsten exhibits high strength, resistance to softening, and low thermal expansion at high temperatures, ensuring that wafers remain free from warping or misalignment.
3. MOCVD Equipment
Tungsten components are extensively used in the epitaxial growth of LED chips and power devices:
Tungsten frames, trays, and pedestals.
Used to support sapphire or SiC substrates.
They offer high-temperature resistance, corrosion resistance, and chemical inertness toward reaction gases, thereby ensuring the quality of the epitaxial layer.
4. Etching Equipment & Vacuum Chamber Components
Within dry etching chambers:
Tungsten frames serve as shielding components, liners, electrode frames, and clamping rings.
They withstand plasma bombardment and resist corrosion from fluorine- or chlorine-based etching gases.
High-purity tungsten prevents metallic contamination, thereby ensuring high process yield.
5. Ion Implantation & Thermal Processing Fixtures
Wafer clamping frames, heat sinks, and shielding covers.
Leveraging tungsten's high density, these components block high-energy ions and minimize scattering contamination.
Tungsten alloy frames are also commonly used in Rapid Thermal Processing (RTP) equipment.
6. Semiconductor Packaging / Ceramic Packaging
Tungsten leadframes and reinforcement frames used in ceramic packages and integrated circuit assemblies.
Tungsten's coefficient of thermal expansion (CTE) closely matches that of ceramics and glass, preventing package cracking.
Offering excellent hermeticity and high mechanical strength, they are utilized in high-reliability devices (e.g., for aerospace, aviation, and military applications).
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