The key role of sputtering targets in high-end manufacturing
Sputtering targets are used to prepare thin film materials in integrated circuits through the magnetron sputtering process and are widely used in key components such as wafer conductive layers, barrier layers, and metal gates. In different technology nodes, metal targets such as aluminum, copper, titanium, and tantalum play differentiated roles according to their characteristics and process requirements. Aluminum targets are still widely used as wiring materials in technology nodes above 110nm, while copper targets have become the mainstream choice in advanced processes below 110nm, and tantalum targets are used as barrier layer materials for copper wiring. Metal sputtering targets for integrated circuits include a variety of high-purity metals, which are used in combination at different technology nodes to meet the needs of logic chips, memory chips, and high-performance, low-power devices. With the advancement of Moore’s Law, the technical requirements for sputtering targets continue to increase, and the research and development direction has shifted to the collaborative design of multi-material systems. In general, as a key link in the integrated circuit industry chain, the technological evolution of sputtering targets is closely linked to changes in market demand. As the global semiconductor industry moves towards smaller processes and higher performance, the material...
2025-05-14
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